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Our areas of expertise
Materials testing
Non-Destructive Testing (NDT)
Radiographic Testing (RT)
Computed Radiography (CR)
Visual Testing (VT)
Penetrant Testing (PT)
Magnetic Particle Testing (MT)
Ultrasonic Testing (UT)
Ultrasonic Phased-Array
Ultrasonic TOFD
Ultrasonic Testing Immersion technology
Mechanised Ultrasonic Testing
Eddy Current Testing (ET)
Mechanical Technological Testing (MTP)
Tensile and compression testing
Notched-bar impact testing
Bend Testing
Hardness testing
Spectral analysis
Special tests
Gear rim testing
Pipeline and heat exchanger testing
Tank bottom inspection
Wire rope testing
Industrial Computed Tomography
Three-dimensional representations of defects and inhomogeneities
Non-destructive dimensioning - Metrology
Target-performance comparison
Wall thickness analysis
Reverse Engineering
Assembly Analysis
Structural analyses
VGSTUDIO MAX Software
Materials and Failure Analysis
Our technology offering (SMART Chart)
Damage analysis
Materials analysis
Scanning electron microscopy (SEM)
Electron microprobe (EPMA/WDX)
X-ray fluorescence analysis (RFA)
Fourier Transformed Infrared Spectroscopy (FTIR)
X-ray diffraction (XRD)
Thermal analysis (TA)
Gas hot extraction
Combustion analysis
Metallography
Ambulant Metallography
Corrosion, corrosion protection and consultation
Plastics
Water analysis and consulting
Semiconductor / Electronics
Asbestos analysis
Expert opinions and reports
Welding Competence Centre
Personnel certification: welder, operator and soldering tests
Welding engineering
Metrology and calibration
Calibration – parameter length
Calibration – parameter torque
Measuring equipment monitoring
3D measurements
Consulting / Services / Seminars
Current Seminars, Courses and Trainings
Expert opinions and reports
Receiving inspection
NDT Supervision Level 3 / Staff Rental
Our fields of activity
Transport technology
Energy production
Aerospace & Aviation
Foundry technology
Medical technology
Mechanical engineering
Pipeline construction
Pharmaceuticals, Chemicals, Food
Additive Manufacturing
Planning and Engineering
Semiconductor / Electronics
Plastics Technology
Bank details
Credit Suisse (Schweiz) AG, Paradeplatz 8, 8070 Zürich
CHF // BIC: CRESCHZZ80A, IBAN CH25 0483 5015 3182 9100 0
EUR // BIC: CRESCHZZ80A, IBAN CH61 0483 5015 3182 9200 1
VAT: CHE-108.817.525 MWST
